JPS6178197A - 電気部品の実装方法 - Google Patents
電気部品の実装方法Info
- Publication number
- JPS6178197A JPS6178197A JP19950284A JP19950284A JPS6178197A JP S6178197 A JPS6178197 A JP S6178197A JP 19950284 A JP19950284 A JP 19950284A JP 19950284 A JP19950284 A JP 19950284A JP S6178197 A JPS6178197 A JP S6178197A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- board
- solder
- leadless
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19950284A JPS6178197A (ja) | 1984-09-26 | 1984-09-26 | 電気部品の実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19950284A JPS6178197A (ja) | 1984-09-26 | 1984-09-26 | 電気部品の実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6178197A true JPS6178197A (ja) | 1986-04-21 |
| JPH0547997B2 JPH0547997B2 (en]) | 1993-07-20 |
Family
ID=16408885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19950284A Granted JPS6178197A (ja) | 1984-09-26 | 1984-09-26 | 電気部品の実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6178197A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019083245A (ja) * | 2017-10-30 | 2019-05-30 | ダイキン工業株式会社 | 電装品箱、電気回路の製造方法 |
| JP2021002568A (ja) * | 2019-06-20 | 2021-01-07 | 矢崎総業株式会社 | 実装基板製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956773U (ja) * | 1982-10-05 | 1984-04-13 | 株式会社東芝 | 両面スル−ホ−ル基板の部品取付構体 |
| JPS59112689A (ja) * | 1982-11-17 | 1984-06-29 | 松下電器産業株式会社 | 両面チツプ実装方法 |
| JPS6088495A (ja) * | 1983-10-20 | 1985-05-18 | 松下電器産業株式会社 | 配線基板 |
| JPS60175488A (ja) * | 1984-02-20 | 1985-09-09 | 松下電器産業株式会社 | プリント基板への部品取付方法 |
-
1984
- 1984-09-26 JP JP19950284A patent/JPS6178197A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956773U (ja) * | 1982-10-05 | 1984-04-13 | 株式会社東芝 | 両面スル−ホ−ル基板の部品取付構体 |
| JPS59112689A (ja) * | 1982-11-17 | 1984-06-29 | 松下電器産業株式会社 | 両面チツプ実装方法 |
| JPS6088495A (ja) * | 1983-10-20 | 1985-05-18 | 松下電器産業株式会社 | 配線基板 |
| JPS60175488A (ja) * | 1984-02-20 | 1985-09-09 | 松下電器産業株式会社 | プリント基板への部品取付方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019083245A (ja) * | 2017-10-30 | 2019-05-30 | ダイキン工業株式会社 | 電装品箱、電気回路の製造方法 |
| JP2021002568A (ja) * | 2019-06-20 | 2021-01-07 | 矢崎総業株式会社 | 実装基板製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547997B2 (en]) | 1993-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |